GaAs Flip Chip...
Analysis Type: Coupled Thermal / Stress
Applications: Thermal Design of Electronic Components...
Description:
Analyses performed to aid in thermal design of flip chips. The region of interest is composed of the area around a single bump extended half way to neighboring bumps. Model includes the substrate, heat spreader, die, emitters, posts, tab and bump. The model took advantage of the problem symmetry.
Flex Board
Hydrocarbon Sensor
GaAs Flip Chip
Engine Controller
Relay Box
Intake Manifold
Wall Mounted TO220
Populated PCB Modal
PWB Enclosure Modal
Plug-in Modules
Aircraft Engines