GaAs Flip Chip...


Analysis Type: Coupled Thermal / Stress
Applications:    Thermal Design of Electronic Components...

Description:
Analyses performed to aid in thermal design of flip chips. The region of interest is composed of the area around a single bump extended half way to neighboring bumps. Model includes the substrate, heat spreader, die, emitters, posts, tab and bump. The model took advantage of the problem symmetry.





 

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