|
|
GaAs Flip Chip...
Analysis Type: Coupled Thermal / Stress
Applications: Thermal Design of Electronic Components...
Description:
Analyses performed to aid in thermal design of flip chips. The region of interest is composed of the area around a single bump extended half way to neighboring bumps. Model includes the substrate, heat spreader, die, emitters, posts, tab and bump. The model took advantage of the problem symmetry.
|
|
