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Aircraft Electronics with Plug-in Modules...
Analysis Type: Coupled Thermal / CFD
Applications: Thermal Analysis of Aircraft Electronics...
Systems Model:
- EFlo's Heat Exchanger Feature Used to Model Two Cold-Plated Sidewalls
- Model Must Predict the Temperature Distribution Throughout The Box in Addition to the Cooling Air Temperature
Motherboard Model:
- Fourteen 4-oz Copper Layer Modeled (Uniform FR4 Layers Between Copper Layers)
- Thermal Boundary Conditions Provided by System Model
Results:
Controller Temperature Distribution
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