|
|
|
|
|
|
Wall Mounted TO220 Device ...
Analysis Type: Structural / Vibration
Applications: Electronics Packaging...
Description:
- Standard Lead Form with Solder Fillets to Pads
- Device Heat Sink Constraint ±X, ±Y, ±Z
- FR4 Rigid Board with Thru Hole & Random Vibrational Excitation
Results:
|
|
|
TES International © 2008 |
Home |
ElectroFlo |
Corporate |
Services |
Examples |
Contact Us
|
|
