Analysis Type: Coupled Electrical / Thermal
Applications: Thermal Design of Sensors and Electronic Components ...
The geometry consists of a membrane structure mounted on a silicon die. Two separate
circuits are formed by platinum traces on the sensor. The outer circuit is the power
generating circuit and the inner one serves as a temperature sensor with negligible
amount of current flowing though it. The membrane consists of several layers totaling
2.6 microns. The silicon die is 400 micron thick and is 6 mm square. There are two
1.34 mm square regions interior to the die where the silicon is etched away leaving
only the membrane.