ThermoFlo; our thermal and fluid flow analysis software package with capabilities for solving thermal and flow problems for many different industries and applications has gone through many improvements recently. ThermoFlo uses a 1D system modeling approach which allows the user to use a component based approach rather than creating a full 3D model. These components can be based on empirical, testing, or other data. This approach allows for rapid prototyping and testing for interchanging different components in a system or for tweaking properties of the model and it’s components.
Please contact us if you would like to try out the new version which includes:
More Library Parts added
Sensors / Sensor Functions Improved
Automatic Report Generation Improvements
Better graphical display
Load Cases Improved
Display Loops separately
Ability to create textboxes on the canvas (can be sensors)
Gallium nitride offers spectacular performance advantages over silicon when applied to power switching – high voltage breakdown, low on‐resistance and unprecedentedly high current densities. GaN Systems in particular has developed a range of devices that fully exploit these attributes. In implementing these devices very considerable thermal and packaging challenges had to be overcome, and innovative solutions devised. This paper describes techniques developed in conjunction with ElectroFlo software for the modeling of thermal transients.
The transient thermal characteristics of a semiconductor device are very important in the prediction of device thermal behavior in different conditions such as switching applications. Knowing the thermal impact of pulse duration for different duty cycles helps to apply the device more efficiently. That is why transient thermal impedance curves appear in many MOSFET data sheets, application notes, and in the literature (see references).
Transient heat transfer is a very complicated process and it is not always easy to obtain results experimentally. Due to the extremely fast response times it is difficult to capture the transient reaction, while the very small device size makes temperature measurement difficult without affecting the behavior. For these reasons thermal simulations assume great importance. The purpose of this paper is to show how this can be done using the thermal analysis software, ElectroFlo.
On Wednesday, September 26th at both 9:00 AM ET and 1:00 PM ET, TES International will be presenting a webinar that is an introduction to ElectroFlo.
ElectroFlo is the latest software to be added to the HyperWorks Partner Alliance offering. This software provides users with a thermal analysis of electronics projects. It cuts analysis times down of complex models while performing thermal, CFD and electrical analyses and automates model clean up. It is fully featured yet user friendly for non-CFD users. To help customers understand the software better and how to use it, we will be hosting a 45 minute webinar.
Title:Advances in Modeling and Simulation of
Complex Thermal Management Systems
Speed and accuracy are critically important in the
modeling and simulation of thermal systems and components. Today’s software
packages either offer approximate modeling using one-dimensional simplistic
flow/thermal network solvers for quick prediction of flow and thermal fields,
or detailed modeling using complex and sophisticated three-dimensional
heat transfer and computational fluid dynamics. The first approach
provides the simulation speed, sacrificing accuracy and can lead to oversimplification,
while the second approach offers accuracy at the cost of speed.
Therefore, the analyst is often forced to make a choice between the two
approaches, or link the two methods. This coupling procedure involves a
very tedious and time-consuming task of interfacing between the two packages
made more difficult without access to the source code.
This presentation discusses the advantages and
shortcomings of each methodology and offers a hybrid approach to bridge the gap
between “speed” and “accuracy”. A variable-fidelity thermal modeling and
simulation methodology is introduced offering a variety of approaches for
modeling complex systems. These include: embedded 2D thermal/electrical planes
ideal for trace modeling, coupled 1D thermal/electrical network for component
definition, and embedded 1D flow-network for modeling of liquid cooling
channels. This approach demonstrated through thermal/electrical/CFD
analysis of a liquid-cooled complex Electronic system.
Hamish Lewis, one of TES’s Engineering Managers, is presenting a paper entitled ”VARIABLE FIDELITY METHODOLOGY FOR THERMAL BATTERY MODELLING” at the ITherm international conference in San Diego this week. This paper discusses the use of our new Software ADFlo for the thermal analysis of Battery systems in automotive applications. Satish Ketkar, a Wayne State Professor and consultant at LG Chem. a battery system manufacturer, is a co-author on the paper.
TES is very pleased to announce that it has just been awarded an 18 month contract by the US Army to enhance our ADFlo Thermal Analysis software and customize it for the Re-Engineering and Development of Vehicle Cooling Systems.
The SBIR Phase II created a software package for thermal management/analysis. This was validated on a military ground vehicle and demonstrated the benefits and potential of thermal analysis with the new software. However, the enhancement allows us to take this package to the next level. At the conclusion of the enhancement, the package will allow for:-
1) A dramatic reduction in modeling time; from weeks to hours, allowing “rapid virtual prototyping” and a greater number of “what-if” scenarios to be performed in a given time.
2) A significant simplification of the analysis process and the required expertise; thus increasing the number of potential analysts. The software will be much easier to use so that engineers can learn the software through the improved training and analyze thermal systems.
3) A considerable reduction in the amount of high cost testing required for confidence in new designs.
4) It will include models of four different vehicles and their respective components, which will allow quick “what-ifs” to be done in the future.
Our thermal management and fluid flow analysis software package, ADFlo, now has a free version available that allows the user to perform thermal analyses for many different industries and applications. The free version’s only limitations are that you can only run up to 50 parts and that you must be connected to the internet. Download ADFlo now!
TES chairman, Dr. Ben Zandi, recently gave a keynote presentation at the SAE World Congress on “Advances in Modeling and Simulation of Vehicle Thermal Management Systems”. Below is the description of the presentiation:
Speed and accuracy are of paramount importance in the modeling and simulation of vehicle systems and components. Today’s commercially available thermal/flow analysis software packages either offer speed or sacrifice speed for accuracy: 1) approximate modeling using one-dimensional (1D) simplistic network solvers (flow and thermal) for quick prediction of flow and thermal fields, or 2) detailed modeling using complex and sophisticated three-dimensional (3D) heat transfer and computational fluid dynamics. The first approach provides the simulation speed, sacrificing accuracy and can possibly lead to oversimplification, while the second approach offers accuracy at the cost of speed. Therefore, the analyst is often forced to make a choice between the two approaches, or find a way to link or couple the two methods. The linking between one-dimensional and three-dimensional models using separate software packages has been attempted and accomplished for a number of years with some frustration. This coupling procedure involves a very tedious and time-consuming task of interfacing between the two packages made more difficult by the lack of access to the source code. Furthermore, there may be issues relating to overall convergence, as well as the convergence of each solver, which can lead to compromised accuracy. For a truly coupled approach, modifications to the source code of the solvers would be required if the analysts had access to it.
This presentation discusses the advantages and shortcomings of each methodology and offers a hybrid approach to bridge the gap between “speed” and “accuracy”. A complete thermal modeling and simulation methodology is introduced offering a variety of approaches for modeling complex systems and components. This avoids any of the unnecessary “overhead” associated with a single modeling approach type. As an example, by allowing the combination of a full three-dimensional analysis in the radiator and the use of a network-based approach for pipes and pumps, the analyst can study the effects of orientation, fouling and related environmental conditions within the radiator and its effect on the complete system. The ability to combine these modeling approaches within a single system model allows one to employ the right tool for the job. This greatly reduces the model development / analysis time allowing for the timely generation of results from which informed design decisions can be inferred. This modeling approach is demonstrated though 1D/3D examples analyzed using the ADFlo software package.