On Wednesday, September 26th at both 9:00 AM ET and 1:00 PM ET, TES International will be presenting a webinar that is an introduction to ElectroFlo.
ElectroFlo is the latest software to be added to the HyperWorks Partner Alliance offering. This software provides users with a thermal analysis of electronics projects. It cuts analysis times down of complex models while performing thermal, CFD and electrical analyses and automates model clean up. It is fully featured yet user friendly for non-CFD users. To help customers understand the software better and how to use it, we will be hosting a 45 minute webinar.
Title:Advances in Modeling and Simulation of
Complex Thermal Management Systems
Speed and accuracy are critically important in the
modeling and simulation of thermal systems and components. Today’s software
packages either offer approximate modeling using one-dimensional simplistic
flow/thermal network solvers for quick prediction of flow and thermal fields,
or detailed modeling using complex and sophisticated three-dimensional
heat transfer and computational fluid dynamics. The first approach
provides the simulation speed, sacrificing accuracy and can lead to oversimplification,
while the second approach offers accuracy at the cost of speed.
Therefore, the analyst is often forced to make a choice between the two
approaches, or link the two methods. This coupling procedure involves a
very tedious and time-consuming task of interfacing between the two packages
made more difficult without access to the source code.
This presentation discusses the advantages and
shortcomings of each methodology and offers a hybrid approach to bridge the gap
between “speed” and “accuracy”. A variable-fidelity thermal modeling and
simulation methodology is introduced offering a variety of approaches for
modeling complex systems. These include: embedded 2D thermal/electrical planes
ideal for trace modeling, coupled 1D thermal/electrical network for component
definition, and embedded 1D flow-network for modeling of liquid cooling
channels. This approach demonstrated through thermal/electrical/CFD
analysis of a liquid-cooled complex Electronic system.