Gallium nitride offers spectacular performance advantages over silicon when applied to power switching – high voltage breakdown, low on‐resistance and unprecedentedly high current densities. GaN Systems in particular has developed a range of devices that fully exploit these attributes. In implementing these devices very considerable thermal and packaging challenges had to be overcome, and innovative solutions devised. This paper describes techniques developed in conjunction with ElectroFlo software for the modeling of thermal transients.
The transient thermal characteristics of a semiconductor device are very important in the prediction of device thermal behavior in different conditions such as switching applications. Knowing the thermal impact of pulse duration for different duty cycles helps to apply the device more efficiently. That is why transient thermal impedance curves appear in many MOSFET data sheets, application notes, and in the literature (see references).
Transient heat transfer is a very complicated process and it is not always easy to obtain results experimentally. Due to the extremely fast response times it is difficult to capture the transient reaction, while the very small device size makes temperature measurement difficult without affecting the behavior. For these reasons thermal simulations assume great importance. The purpose of this paper is to show how this can be done using the thermal analysis software, ElectroFlo.
Read the full white paper
Here is the link to the webinar on the Altair site. http://hyperworksalliance.com/EventDetail.aspx?event_id=2906&event_culture=Global®ion=Global&date_location_id=2387
Title: Advances in Modeling and Simulation of
Complex Thermal Management Systems
Speed and accuracy are critically important in the
modeling and simulation of thermal systems and components. Today’s software
packages either offer approximate modeling using one-dimensional simplistic
flow/thermal network solvers for quick prediction of flow and thermal fields,
or detailed modeling using complex and sophisticated three-dimensional
heat transfer and computational fluid dynamics. The first approach
provides the simulation speed, sacrificing accuracy and can lead to oversimplification,
while the second approach offers accuracy at the cost of speed.
Therefore, the analyst is often forced to make a choice between the two
approaches, or link the two methods. This coupling procedure involves a
very tedious and time-consuming task of interfacing between the two packages
made more difficult without access to the source code.
This presentation discusses the advantages and
shortcomings of each methodology and offers a hybrid approach to bridge the gap
between “speed” and “accuracy”. A variable-fidelity thermal modeling and
simulation methodology is introduced offering a variety of approaches for
modeling complex systems. These include: embedded 2D thermal/electrical planes
ideal for trace modeling, coupled 1D thermal/electrical network for component
definition, and embedded 1D flow-network for modeling of liquid cooling
channels. This approach demonstrated through thermal/electrical/CFD
analysis of a liquid-cooled complex Electronic system.
TES has just released ElectroFlo version 4.6. The main features of the new version are as follows:
- 2D Solids
- 3D Window is faster and improved
- Draw 3D results in ElectroFlo 3D window (you can still use the 3rd party package Paraview)
- 3D results mapped onto CAD
- Faster Loading/Saving models
- Various Minor Bug Fixes and Improvements
Click here to request an evaluation of ElectroFlo